靶材钎焊连接质量的超声成像检测技术  

Ultrasonic Imaging Technique on Joining Quality of Target Assembly

作　　者：陈振华[1] 史耀武[1] 

机构地区：[1]北京工业大学材料科学与工程学院先进材料加工技术研究所,北京100022

出　　处：《无损检测》2007年第5期244-246,共3页Nondestructive Testing

摘　　要：采用超声成像方法对微电子器件镀膜靶材钎焊质量进行检测,获得其A扫描和C扫描图像。根据扫描图像判断缺陷的大小、种类及位置,并通过断面金相分析进行验证。试验表明,超声成像检测方法能够高效、快速、全面地反映出钎焊界面的接合状态及内部缺陷,是一种较好的检测钎焊靶材连接质量的无损检测方法。Ultrasonic imaging technique was adopted to evaluate the joining quality of a target assembly used in microelectronic technology. Dimension, location and variety of defects were determined by its A-scan and C-scan images. Then the testing results were proved by metallographic analysis. Testing results showed that the ultrasonic imaging technique could be used to evaluate the joint state and interior defects, and it is a good nondestructive testing method for the joining quality evaluation of target assembly.

关 键 词：超声成像检测 靶材 钎焊 连接质量评估 

分 类 号：TG115.28[金属学及工艺—物理冶金]