电镀法石墨粉镀铜工艺及铜含量的测定  

Copper Electroplating on Graphite Powders and Copper Content Measurement

作　　者：李闯[1] 夏金童 商玲玲[1] 肖勇[1] 吴旭升[1] 邵浩明[1] 

机构地区：[1]湖南大学材料科学与工程学院,湖南长沙410082

出　　处：《机械工程材料》2007年第5期27-29,共3页Materials For Mechanical Engineering

基　　金：国家自然科学基金(59972009)

摘　　要：采用电镀法对石墨粉进行了镀铜,研究了镀铜过程中浓硫酸及石墨粉的加入量、电流密度和电镀时间对镀铜效果的影响,并研究了镀铜石墨粉中铜含量的测定分析方法。结果表明:在800 mL蒸馏水中加入8g CuSO_4·5H_2O和20 mL浓硫酸及5g处理过的石墨粉,每5～10 min搅拌0.5 min,镀铜电流密度9 A·dm^(-2)(或21A·dm^(-2)),时间为60 min(或20 min),石墨粉镀铜效果较好。镀铜石墨粉在900℃充分氧化后通过氧化前后质量计算可求得其中的铜含量。Graphite powders were coated with copper by copper electroplating method. The effect of concentrated sulfuric acid addition, graphite powder addition, current density, and copper electroplating time were studied. The copper content measuring method was studied, too. The results indicate, adding 8 g CuSO4 · 5H2O, 20 mL concentrated sulfuric acid, and 5 g pretreated graphite powders in 800 mL distilled water, which is stirred 0. 5 min every 5 to 10 min, and when electroplating current is 9 A · dm^-2 （or 21 A · dm^-2） and time is 60 min （or 20 min）, the copper electroplating effect is excellent. After the electroplated graphite powders are intensively oxidized in 900 ℃, the copper content could be obtained by calculating the mass before and after oxidation.

关 键 词：石墨粉 电镀 铜含量测定 

分 类 号：TB333[一般工业技术—材料科学与工程]