H62/Cu同基合金磁控电弧离子镀镀层显微组织  

Microstructure of H62/Cu Layer Deposited by Magnetron Arc Ion Plating

作　　者：刘和平[1] 袁庆龙[2] 侯文义[2] 

机构地区：[1]太原理工大学材料科学与工程学院,山西太原030024 [2]太原理工大学机械工程学院,山西太原030024

出　　处：《金属热处理》2007年第5期13-15,共3页Heat Treatment of Metals

基　　金：山西省自然科学基金资助项目(20041060)

摘　　要：用扫描电子显微镜和能谱仪对H62/Cu同基合金磁控电弧离子镀镀层进行了研究。结果表明,电弧离子镀电流对镀层晶粒尺寸有较大影响,弧电流较小时镀层晶粒较细,而弧电流较大时镀层的晶粒粗大。镀层主要由3部分组成:过渡层(伪扩散层+真扩散层)、细晶层和蘑菇状晶粒层。镀层中铜、锌元素分布不均匀,造成这种现象的原因与铜、锌的熔点及其离子的电离能有关。The alloying plated layer with the same basic composition as both deposited material and substrate, prepared by magnetron ion plating with arc source process, was analyzed with SEM and EDS. The results show that the arc current has obvious influence on particle size of the coating. The lower the arc current is, the smaller the particle size of layer become, and vice versa. The layer includes three parts： transition layer, fine grain layer and mushroom-like layer. The nonhomogeneous distribution of Cu and Zn in the plated layer is due to the differece of their melting points and ionization potentials.

关 键 词：磁控 离子镀 镀层 同基合金 

分 类 号：TG174.444[金属学及工艺—金属表面处理]