连铸结晶器表面电镀技术的应用进展  

Application & Development of Electroplating Technology on Continuous Casting Mold Surface

作　　者：侯峰岩[1] 谭兴海[1] 蒋丽敏[1] 黄丽[1] 张跃刚[1] 毕刚[1] 李朝雄[1] 

机构地区：[1]上海宝钢设备检修有限公司宝钢机械厂,上海201900

出　　处：《表面技术》2007年第3期61-63,共3页Surface Technology

摘　　要：对结晶器进行表面处理可以大大提高其使用寿命,电镀技术是结晶器表面处理领域的主要表面技术。分析了连铸结晶器表面电镀技术的应用发展空间,分别从面向产品性能、面向生产、面向用户的角度阐述了结晶器表面电镀技术的应用现状及发展方向。认为未来的连铸结晶器表面处理领域,电镀技术将同其他表面技术共同并存、优势互补,电镀技术仍将具有很好的开发应用前景。Surface treatments on continuous casting mold （ CCM） will greatly increase its service life, and electroplating is the leading surface technology in the field of mold surface treatment. It is analyzed the status and development of electroplating technology on CCM, orienting the aspects of product characteristic, manufacturing and the customer. And it is concluded that the electroplating technology will have a well prospect in the field of CCM surface treatment, besides, co-developing with other surface treatment and complementing the advantages with each other.

关 键 词：连铸结晶器 电镀技术 表面技术 产品全生命周期 

分 类 号：TG174.44[金属学及工艺—金属表面处理] TF777[金属学及工艺—金属学]