颗粒增强Cu基点焊电极复合材料的现状及展望  

Research status and prospect on composite Cu base spot electrode with particle strengthened

作　　者：李宪洲[1] 杜有龙[1] 王慧远[1] 姜启川[1] 

机构地区：[1]吉林大学材料科学与工程学院教育部汽车材料重点实验室,长春市130025

出　　处：《焊接》2007年第6期13-19,共7页Welding & Joining

基　　金：国家自然科学基金(50371030)

摘　　要：综述了颗粒增强Cu基点焊电极复合材料的研究现状,着重介绍了几种增强体(氧化物、碳化物、硼化物和氮化物等)的制备、性能和应用以及各自的优缺点,最后,对颗粒增强Cu基复合材料点焊电极的研究方向提出了一些看法和展望,认为颗粒增强点焊电极复合材料在工业领域中有很广阔的应用前景。Several substances (such as oxides, carbides, borides and nitrides) with strengthening effect and their preparing methods, properties and applications as well as their merits and shortcoming were introduced respectively. At last, the developing tendency about composite Cu base spot electrode with particle strengthened was viewed, which maybe possess good prospect and broad market in industry.

关 键 词：颗粒增强 复合材料 点焊电极 

分 类 号：TB331[一般工业技术—材料科学与工程]