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机构地区:[1]北京航空航天大学工程系统工程系,北京100083
出 处:《系统工程与电子技术》2007年第5期828-831,共4页Systems Engineering and Electronics
基 金:"十五"国防预研项目资助课题(41319030101)
摘 要:针对加速寿命试验发展的瓶颈问题——加速模型的确定,将国际上已提出的具有代表性的多应力加速模型进行了具体介绍和分析。从模型提出的方法及其适用性出发,特别讨论了Fallou等人提出的适用于电子绝缘器件的各种温度电应力加速模型,以及由美国马里兰大学Barker等人提出的适用于简单印制电路板的温度振动应力加速模型。最后通过各种模型的对比以及模型与实际情况间差距的分析,指出了现有多应力加速模型存在的缺陷及其发展趋势。When inference concerning the life length of high reliability items is required, accelerated life testing which is conducted in a more severe environment than occurs in actual use is used to save time and cost of testing. In order to make inference about the life length of the item operating under use conditions based on failure data obtained under the more severe environment, the key is to determine a multiple-stress model. An outline on some representational multiple-stress models in the wodd is given. In particular, several electrical-insulator accelerated models under combined thermal and electrical stress are presented and their applicability is analyzed. These include models proposed by Fallou, et al. In addition, an accelerated model on simple PWB under temperature and vibration proposed by Barker is also discussed. Some areas that should be continued to develop are finally pointed out.
分 类 号:TB114[理学—概率论与数理统计]
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