铁粉表面置换镀铜的动力学  

Kinetics of Surface Transpositional Coating of Copper on Iron Powder

作　　者：金洋华[1] 吴世学[1] 

机构地区：[1]重庆大学材料科学与工程学院,重庆400044

出　　处：《材料导报》2007年第F05期226-229,共4页Materials Reports

摘　　要：通过对硫酸铜溶液中铜置换包覆铁粉的研究,发现置换速率明显受到温度、搅拌速率、初始铜浓度以及溶液pH值的影响。置换速率随温度、搅拌速率和初始铜浓度的增加而增加。溶液pH值在弱酸性时,有利于置换反应的进行。该体系的置换反应机理符合扩散控制机理。动力学数据服从一级反应速率的规律。Through the study of kinetics of surface transpositional coating of copper on iron powder,it＇s found that the reaction is affected by temperature, stirring speed,initial concentration of Cu and the pH value of copper sulfate solution. Substitutive rate is increased with the increase of temperature,stirrlng speed,and initial concentration of Cu in solution. The weak acidic medium avails to the replacement of copper. The precipitating reaction of the substitutive system is controlled by diffusion. The rule of first-order reacting rate is obeyed by kinetic data of the substitutive reaction.

关 键 词：置换镀 铜 动力学 

分 类 号：O643.1[理学—物理化学]