置换镀金工艺  

Electroless Gold Plating

作　　者：韩克平[1] 方景礼[1] 

机构地区：[1]南京大学应用化学研究所,210093

出　　处：《材料保护》1997年第1期24-27,共4页Materials Protection

摘　　要：研究了置换镀金液组成和操作条件对金的沉积速度的影响，并对金镀层的性能进行了测试。结果表明，该工艺具有镀层光亮平整、与基体结合力好、沉积速度快、镀液稳定、使用寿命长、维护方便等特点。可用于各式印刷线路板镀金，并可作为电子产品的自催化化学镀厚金前的顶覆金层。The effects of the solution components and operating conditions on gold depositiqn rate were studied,and the characteristics of the deposit were also determined by SEM, ZRD and XPS analyses. A smooth-bright,good adhe-sive, high purity gold deposit cna be obtained by this technology with the virtue of high deposition rate,high stability,convenient maintainence and low cost. The technology not only can be applied to the gold plating of all kinds of printed circuit board,but also can be used to produce the displacement gold deposit before autocatalytic electroless gold plating.

关 键 词：置换 镀金 电镀 

分 类 号：TQ153.18[化学工程—电化学工业]