PEG-Cl^-添加剂存在下的铜电结晶过程研究  

Electrocrystallization of Copper in the Presence of PEG-Cl^- Additive

作　　者：辜敏[1] 李强[1] 鲜晓红[2] 卿胜兰[1] 刘克万[1] 

机构地区：[1]西南资源开发与环境灾害控制工程教育部重点实验室,重庆400044 [2]重庆大学化学化工学院,重庆400044

出　　处：《化学学报》2007年第10期881-886,共6页Acta Chimica Sinica

基　　金：高等学校重点实验室访问学者基金(2005)资助项目.

摘　　要：用线性电位扫描、循环伏安和计时安培电化学方法研究了聚乙二醇(PEG)和Cl-同时存在时,酸性镀铜溶液中Cu在玻碳电极(GCE)上的电结晶过程.研究表明,PEG-Cl-作用下Cu的电结晶按瞬时成核和三维生长方式进行.PEG-Cl-使电极表面的活性点急剧减少,并降低了Cu2+的扩散系数,阻化了Cu的电沉积和成核过程.PEG-Cl-作用时,Cl-离子仍然表现出较强的促进作用,随Cl-浓度的增大,Cu2+的扩散系数、Cu的沉积速度和成核速度都有所提高.适宜的PEG,Cl-浓度使成核数密度增大.Linear sweep voltammetry, cyclic voltammetry and chronoamperometry techniques were employed to study the copper electrocrystallization process on a glass carbon electrode （GCE） from acid cupric sulfate electrolytes in the presence of polyethylene glycol and Cl^- ions. The instantaneous nucleation fol- lowed by three-dimensional growth was found for the electrocrystallization from the electrolytes with PEG-Cl^-. The electrochemical active sites on the GCE surface decrease in the presence of PEG-Cl^- in electrolytes, which inhibited the electrodeposition and electrocrystallization of copper sharply. However, Cl^- ions had a strong accelerant effect. With the increase of Cl^- ion concentration, the diffusion coefficient of Cu2＋, and the rate of copper electrodeposition and nucleation were promoted. An optimum chloride ion and PEG concentration increased the nuclear density on the GCE surface, which was beneficial to electrodeposits.

关 键 词：CU PEG-Cl^- 电沉积 电结晶 玻碳电极 

分 类 号：O646.5[理学—物理化学]