流动镀Ni-P合金镀层工艺的研究  

Study on Ni-P Alloy Flow Plating Process

作　　者：于文忠[1] 俞宏英[1] 王玉[1] 孙冬柏[1] 孟惠民[1] 樊自栓[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《装备环境工程》2007年第3期77-80,共4页Equipment Environmental Engineering

基　　金：北京市教委科技发展计划基金重点项目(KZ200410028012)

摘　　要：电沉积Ni-P合金镀层由于其优异的性能而在多个领域得到了广泛的应用;流动镀电沉积由于可以较快地提高电沉积速度而受到极大的关注;建立了镀液平行式流过电极表面的流动镀装置,采用该流动镀装置,通过改变电流密度、流速、电极间距等不同的工艺条件,研究了流动镀条件下,电流密度、流速、极间距对电沉积Ni-P合金镀层中P含量和表面形貌的影响规律,并初步探讨了流动镀条件下各工艺条件对电沉积过程的影响机理。Ni-P deposit was widely used in many fields due to its excellent properties. Flow plating was concentrated greatly as it can improve the deposition rate. Equipment of flow plating was set up in which the electrolyte flow over the surface of the electrodes parallelly. With this equipment, the influence of current density, flow rate of the electrolyte, electrode distance on the phosphorus, and content and morphology of the deposits was investigated by changing the different technology conditions. The effect mechanism of different technology factors on the course of electro-deposition was also discussed.

关 键 词：流镀 NI-P镀层 表面形貌 P含量 

分 类 号：TQ153.2[化学工程—电化学工业] TP174.44[自动化与计算机技术—控制理论与控制工程]