C_(18)反相硅胶键合相的制备与性能评价  

Preparation and characterization of C_(18) silica bonded phase

作　　者：田毅峰[1] 李先国[1] 沙春洁[1] 冯丽娟[1] 周晓[1] 王振永[1] 

机构地区：[1]中国海洋大学化学化工学院,山东青岛266003

出　　处：《化学试剂》2007年第1期12-14,共3页Chemical Reagents

摘　　要：以20-40μm无定形硅胶为载体,与十八烷基三氯硅烷进行键合制备了C18反相硅胶键合相。热重差热分析表明所得键合相230℃以下热稳定性良好,对残留硅羟基的定量测定表明采用三甲基氯硅烷进行封端反应可消除3/4以上的残留硅羟基,柱层析试验表明该键合相具有良好的分离效果。The chlorosilane-bonded silica packing was prepared through the reaction of oetadeeyhriehlorosilane with amorphous silica （20 - 40 μm）. Differential thermal analysis-thermal gravity analysis （TG-DTA） was employed to characterize the properties of the product. The result showed that the organic layer had a good thermal stability at 230 ℃ . More than 3/4 of the residual hydroxyl groups were eliminated after the capping reaction with Me3SiCl. Results from column chromatography test showed that the C18 bonded silica packing had good separating capability.

关 键 词：氯硅烷 硅烷化反应 C18反相硅胶键合相 

分 类 号：O634.4[理学—高分子化学]