淀粉粘结剂在有机复混肥造粒中的应用  

Application of starch adhesive in organic compound fertilizer granulation

作　　者：李彦明[1] 刘晓霞[1] 李国学[1] 魏远[1] 

机构地区：[1]中国农业大学资源与环境学院,北京100094

出　　处：《中国生态农业学报》2007年第3期29-31,共3页Chinese Journal of Eco-Agriculture

基　　金："十五"国家科技攻关项目"高效有机肥与缓释肥产业化技术研究与开发"(2002BA516A03);国家高技术研究(863)发展计划项目"新型多功能生物有机肥的研究与开发"(2002AA245031)资助

摘　　要：目前无机粘结剂在有机复混肥造粒生产中应用相当广泛,但其自身不可避免的缺点越来越限制它在有机复混肥中的应用。试验表明:天然玉米淀粉不适于直接作为有机复混肥造粒粘结剂,但将玉米淀粉进行改性后的液体粘结剂A和干粉粘结剂B作为有机复混肥造粒粘结剂,符合中国复混肥标准的要求,且优于国家标准;颗粒成粒率大于93%,其返料率低,用量不超过1%;颗粒的抗压碎力大于10N,且颗粒完好率为100%。将改性淀粉基粘结剂替代无机粘结剂凹凸棒,在有机复混肥造粒生产上完全可行,且可用作高浓度养分含量的有机复混肥造粒。Although mineral binder bonds are widely used in organic compound fertilizers, their inevitable shortcomings limit their application in the organic compound fertilizers. Direct application of crude cornstarch （CK2） adhesive is unfit for granulation of organic compound fertilizers. But the use of liquid adhesive A and dry powder adhesive B（ both obtained by the modification of cornstarch）as granulation adhesive in organic compound fertilizer granulation produces granules with quality exceeding Chinese and International Standards. Both two adhesives have granulation percentage greater than 93%, return products less than attapulgites＇ ,and used level under 1%. The granules resist crushing forces greater than 10N,and maintain a 100 % integrity after immersed in deionized water for 24 hours. Modified cornstarch adhesives practically substitute inorganic binders. Adhesive A and B can be used as granulation adhesive for high nutrient-rich organic compound fertilizers.

关 键 词：淀粉粘结剂 无机粘结剂 有机复混肥 造粒 

分 类 号：S143.6[农业科学—肥料学]