多功能发热模块的散热冷板设计  

Thermal Design of Cool-Plate for Multifunctional Modules

作　　者：付娟 吴本南[1] 丁飞[1] 

机构地区：[1]中国电子科技集团公司第38研究所,安徽合肥230031

出　　处：《电子机械工程》2007年第3期31-34,共4页Electro-Mechanical Engineering

摘　　要：主要介绍了某可扩充多功能发热模块的热设计方案,将理论计算的迭代过程输入C程序,并结合理论计算结果进行计算机辅助热分析,在很大程度上减轻了计算和设计负担。最后做相应的试验来校对其准确性,减少了设计过程中的重复实验费用,并缩短了设计周期。This paper introduced the cooling project for a group of high power muhifunctional modules. The iteration of theory computation was programmed in C language, and the CFD simulation was integrated with the result of theoretical calculating. This method deceased the work of design and calculation greatly. The result of experimentation proved the validity of this project. This method can reduce the cost of repeating experiments in design and furthermore, shorten the period of designing.

关 键 词：计算流体力学 湍流 热扩散 

分 类 号：O35[理学—流体力学] O357.5[理学—力学]