CuMn基含Ti预合金钎焊金刚石的结合界面分析  

Bonding interface of containing-Ti prealloy based CuMn and diamond grit via brazing

作　　者：袁洁[1] 赵宁[1] 南俊马[1] 徐可为[1] 

机构地区：[1]西安交通大学金属材料强度国家重点实验室,西安710049

出　　处：《焊接学报》2007年第6期69-72,共4页Transactions of The China Welding Institution

基　　金：陕西省工业攻关资助项目(2005K06-G8)

摘　　要：设计并用气雾化法试制以CuMn为基的含Ti预合金粉末,以此为粘结胎体在粗真空钎焊条件下制备金刚石复合材料,考察预合金与金刚石之间的界面结合状况。钎焊制备的主要依据是经差热分析测定的预合金熔点(约为1 151 K)和试验定性观测的流动性及铺展性。结果表明,在试验条件下伴随界面两侧成分的迁移变化,预合金胎体中的Ti原子与金刚石表层的C原子发生化学反应并生成TiC,且呈非连续岛状分布于金刚石表面,这有助于提高金刚石的把持力。A containing-Ti prealloyed powder was designed to be used as an adhesion matrix to increase the diamond retention,and then made from the Cu and Mn by gas atomization.An analysis was made to the metal-diamond bonding interface after the bulk composites being hot-pressed in rough vacuum brazing,which is produced according to the characteristics of the containing-Ti powder with the melting temperature(about 1 151 K) determined by thermal analyzer,and the liquidity and spreadability were observed experimentally.It was found that the discrete island-shaped TiC occurs on the diamond surface,and the contents of Ti and C change obviously in both sides of the interface with Ti rich in the region closed to the diamond and C rich in the region closed to a matrix,because of the chemical reaction based on the introduction of a strong carbide-forming element Ti to the prealloyed powders.

关 键 词：钎焊 结合界面 含Ti预合金粉末 冶金结合 金刚石 

分 类 号：TG454[金属学及工艺—焊接]