CURING PROCESS OF PHOTOPOLYMER RESIN BOND DIAMOND TOOLS  

作　　者：GAO Tao PENG Wei YAO Chunyan 

机构地区：[1]Ministry of Education Key Laboratory of Mechanical ManufactureZhejiang University of Technology, Hangzhou 310014, China

出　　处：《Chinese Journal of Mechanical Engineering》2007年第3期6-8,共3页中国机械工程学报（英文版）

基　　金：This project is supported by National Natural Science Foundation of China (No. 50075084);Advanced Manufacturing Technology & Equipment Zhejiang Provincial Key Disciplines, China.

摘　　要：Analytical simulation and corresponding proof-test are adopted to study the principle of the curing process of photopolymer resin diamond tools. The influence of the diamond as abrasives in photopolymer resin owing to the absorptivity of the diamond for the UV light on the photopolymer resin curing process is discussed. Based on the above, a kind of diamond tool—dicing blade is selected to analyze the curing process of photopolymer bond diamond tools. An analytical model of curing process is developed and a correlation curve between the depth of polymerization of the photopolymer resin diamond tools and the exposure time to represent the curing process of photopolymer bond dicing blade. A test is done to proof-test the validity of the analytical model and the correlation curve. The simulated data fit the experimental results, which demonstrates the analytical models and numerical algorithm are of high reliability. The analytical simulation method could possibly be used to optimize the curing cycle and improve the quality of the photopolymers resin bond diamond tools.Analytical simulation and corresponding proof-test are adopted to study the principle of the curing process of photopolymer resin diamond tools. The influence of the diamond as abrasives in photopolymer resin owing to the absorptivity of the diamond for the UV light on the photopolymer resin curing process is discussed. Based on the above, a kind of diamond tool—dicing blade is selected to analyze the curing process of photopolymer bond diamond tools. An analytical model of curing process is developed and a correlation curve between the depth of polymerization of the photopolymer resin diamond tools and the exposure time to represent the curing process of photopolymer bond dicing blade. A test is done to proof-test the validity of the analytical model and the correlation curve. The simulated data fit the experimental results, which demonstrates the analytical models and numerical algorithm are of high reliability. The analytical simulation method could possibly be used to optimize the curing cycle and improve the quality of the photopolymers resin bond diamond tools.

关 键 词：PHOTOPOLYMER Curing process SIMULATION Diamond tools 

分 类 号：TH16[机械工程—机械制造及自动化]