电沉积法制备的超细晶薄铜板拉伸及表面层效应  

Tensile test and surface layer effect of ultra fine grain thin copper sheet prepared by electrodeposition

作　　者：童敏杰[1] 王长文[1] 雷鹍[1] 张凯锋[1] 

机构地区：[1]哈尔滨工业大学材料科学与工程学院,黑龙江哈尔滨150001

出　　处：《锻压技术》2007年第1期16-19,共4页Forging & Stamping Technology

摘　　要：利用电沉积方法制备了晶粒大小均匀、致密的细晶薄铜板材料,研究了其在室温单向拉伸试验中由于晶粒大小、厚度变化引起材料强度和塑性的变化,通过表面层效应对产生的尺度效应进行了分析。随晶粒度的增大,材料的塑性和流动应力都发生了降低,这是由于表层晶粒所占份额增加。而且,由于表面层效应,随着试件厚度的减少,材料的流动应力降低。Fine grained thin copper sheet was prepared by electrodeposition method. The grains size is uniform and the density is high. The changes during tensile test at room temperature of materials strength and plasticity are investigated for deferent grain size and thickness. The scale effects are analyzed adopt surface layer effect. The plasticity and flow stress increase with grain size growth, because the volume ratio of grains on surface layer increases. Flow stress reduces with thickness reducing, which is also because the effect of surface layer.

关 键 词：电沉积 超细晶铜 表面层效应 尺度效应 

分 类 号：TG386[金属学及工艺—金属压力加工]