铜基钎料真空钎焊金刚石  

Experimental research on vacuum brazing of diamond with active Cu-based alloy

作　　者：刘心宇[1] 张汉城[1] 李东平[2] 

机构地区：[1]桂林电子科技大学,广西桂林541004 [2]国家特种矿物材料工程技术研究中心

出　　处：《金刚石与磨料磨具工程》2007年第3期26-28,共3页Diamond & Abrasives Engineering

摘　　要：采用铜基合金钎料,适当控制钎焊工艺,实现了金刚石与钢基体的高强度连接。借助扫描电镜(SEM)、X射线能谱(EDS)、X射线衍射(XRD)分析了真空加热条件下,对铜基合金钎料与金刚石之间的界面反应,钎焊面进行了表面形貌和结构分析。探讨了钎料与金刚石界面处碳化物的形成机理。阐明了在钎焊过程中Ti元素在金刚石界面形成富Ti层并与金刚石表面的C元素反应生成TiC、SnTi C是实现合金层与金刚石有较高结合强度的主要因素。钎料与钢基体在钎焊温度下发生组元间相互扩散,形成了固溶体及其化合物,从而实现钎料与钢基体的高强度结合,并对一系列铜基钎料进行了测试。The high-strength bonding between diamond grit and steel matrices was realized by using a Cu-based alloy under controlled brazing conditions. The interface between the Cu-based alloy and diamond grit was analyzed by using scanning electronic microscopes and X-ray diffraction. The formation mechanism of carbide layers was discussed. Testing results show that the Ti element in the alloy is accumulated onto diamond surface and reacts with C element the surface to form all TiC layer. As a result, metallurgical bonding is produced between the alloy and the diamond grit.

关 键 词：金刚石 钎焊 化学冶金结合 

分 类 号：TG454[金属学及工艺—焊接] TQ164[化学工程—高温制品工业]