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作 者:刘福平[1] 杨凯珍[1] 陈志祥[1] 蔡志红[1] 蔡沛沛[1] 黄云帅[1] 刘凤美[1]
机构地区:[1]广州有色金属研究院焊接材料研究所,广东广州510650
出 处:《材料研究与应用》2007年第2期140-142,共3页Materials Research and Application
摘 要:对空气雾化制备的A1-Si共晶合金粉末钎料粒度分布进行了研究,结果表明,粉末钎料粒度分布呈双峰曲线,主要分布在105~246μm之间.运用二次破碎机理对颗粒分布特征进行了分析,并推导出液滴发生二次破碎极限尺寸的计算公式.The size distribution of the powder solder for A1-Si eutectic alloy using gas atomization is studied. It is pointed out that the size distribution of the powder solder covered a range of 105 to 246μm. The size distribution curve indicates a bimodal population. It is proposed that these large droplets undergo fur ther disintegration in flight to produce the powder (secondary break-up). Although adequate theories are not available for the prediction of the sizes of the daughter particles, methods in the present work are available for the estimation of the stable particle ranges. Research in single liquid droplet has shown that secondary break-up will not occur unless these sizes of liquid droplets exceed a critical value.
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