一种改进的半导体生产线批处理机调度策略研究  

Improved scheduling strategy for batching tools in semiconductor wafer fabrication

作　　者：王晓峰[1] 谷寒雨[1] 

机构地区：[1]上海交通大学自动化研究所,上海200240

出　　处：《计算机集成制造系统》2007年第6期1115-1120,共6页Computer Integrated Manufacturing Systems

摘　　要：研究了半导体生产线上有加工类型限制的并行批处理机组调度问题,其目标是最小化总加权拖期交货损失,从而最大程度地满足客户的按期交货要求。在研究了ATC-BATC和DBDH规则的基础上,提出了一种改进的ATC-BATC调度规则,通过反馈控制局部在制品数量来改善系统性能,并通过仿真证明该规则能更有效地减小总加权拖期交货损失。The scheduling problem for parallel batching tools with incompatible families in semiconductor wafer fabrication was studied. To improve the performance of on-time delivery in semiconductor manufacturing, aimed to minimize the Total Weighted Tardiness （TWT）, an improved Apparent Tardiness Cost （ATC）-Batch Apparent Tardiness Cost （BATC） scheduling rule was proposed, which controlled SUBsection of Work in Process （SUBWlP）. Result of simulation showed that TWT was effectively reduced by proposed method.

关 键 词：半导体生产线 批处理 调度 仿真 

分 类 号：TP278[自动化与计算机技术—检测技术与自动化装置]