乙酰丙酮铝对环氧树脂/酸酐体系的固化促进作用的研究  

Study on Curing Acceleration of Epoxy/Anhydride System with Aluminum Acetylacetonate as Accelerator

作　　者：董月云[1] 郑芸[1] 江平开[1] 韦平[1] 

机构地区：[1]上海交通大学化学化工学院,上海市电气绝缘与热老化重点实验室,上海200240

出　　处：《绝缘材料》2007年第1期26-28,共3页Insulating Materials

基　　金：上海市科委科技攻关项目(05dz22303)

摘　　要：以乙酰丙酮铝(AlAcAc)作为脂环族环氧树脂/液体酸酐体系潜伏性促进剂,由动态DSC曲线放热峰的位置和形状可发现添加少量的乙酰丙酮铝能有效地促进酸酐固化环氧的反应并且降低起始反应温度,介电损耗-温度谱实验显示整个温度范围内样品均保持较低的介损值,40℃下配方样品的tanδ均低于0.001,150℃的tanδ不超过0.0375。同时由动态DSC不同升温速率下跟踪体系固化反应过程,利用Kissinger和Crane方程对该固化反应进行了动力学分析,计算了固化动力学参数,固化反应表观活化能ΔEa=48.3kJ/mol,反应级数n=0.89。The Cycloaliphatic epoxy （ERL 4221）/ Carboxylic anhydride （MHHPA） system with aluminum acetylacetonate （AIAcAcs） as accelerator was studied by non-isothermal DSC and also examined the dielectric performance behaviors. An increase of AlAcAc content accelerated the reaction and decreased the initial temperature of reaction. From the dielectric dissipation factor-temperature diagram, the result showed that all formulations offered system with low dielectric dissipation factor during the whole temperature range, tanδ was less than 0.001 at 40℃ and did not exceed 0.037 5 at 150℃The kinetics of the curing processes were analyzed by Kissinger and Crane equations, based on which discussed the curing kinetic parameters of the curing systems： the activation energy △Ea= 48.3 kJ/ mol, the reaction order value n = 0.89

关 键 词：环氧树脂 酸酐 乙酰丙酮铝 潜伏性促进剂 DSC 介电损耗 反应动力学 

分 类 号：TM215.1[一般工业技术—材料科学与工程] TQ323.5[电气工程—电工理论与新技术]