TDE-85环氧树脂固化动力学的DSC和DMA研究  

Study on curing kinetics of TDE-85 epoxy resin by means of DSC and DMA

作　　者：吴晓青[1] 李嘉禄[1] 康庄[2] 吴世臻[2] 

机构地区：[1]天津工业大学先进纺织复合材料教育部重点实验室,天津300160 [2]天津工业大学材料科学与化学工程学院,天津300160

出　　处：《固体火箭技术》2007年第3期264-268,共5页Journal of Solid Rocket Technology

基　　金：天津市自然科学基金资助项目(06YFJMJC03100;013604311)

摘　　要：根据DSC和DMA测试曲线,分别用Kissinger、Flynn-Wall-Ozawa、Friedman-Reich-Levi模型计算了TDE-85/THPA环氧树脂体系的固化动力学参数。Kissering法所得活化能较低,其他几种计算方法所得活化能比较一致,相对误差在10%之内。将Gaussian分布应用于分峰法,计算了每个反应的动力学参数,模拟结果与DSC曲线具有很好的一致性。双峰表明,固化过程包含2个化学反应,缩水甘油脂基的反应活性比脂环基高。利用外推法确定了固化工艺为100℃/6 h+130℃/4 h+160℃/2 h。Based on DSC and DMA curves, curing kinetic parameters of TDE-85/THPA epoxy rosin system were calculated by means of several thermoanalysis methods, such as Kissinger, Flynn-Wall-Ozawa and Friedman-Reich-Levi. The activation energy calculated by Kissinger equation is the lowest, and the values of activation energy calculated by other methods are close with relative error within ten percent. The Gaussian distribution was applied to the peak separation. Kinetic parameters for each reaction were calculated. The simulation results agree well with DSC curves. Double peaks show that curing process contains two - step reactions. Activity of the glycide group is higher than that of cycloaliphatic epoxy groups. Through extrapolation method, curing process is defined as 100 ℃/6 h ＋ 130 ℃/4 h ＋ 160 ℃/2 h.

关 键 词：TDE-85环氧树脂 固化动力学 示差扫描量热法 动态力学分析 分峰法 

分 类 号：V255[一般工业技术—材料科学与工程]