Effect of ultrasonic power on wedge bonding strength and interface microstructure  

作　　者：王福亮 李军辉 韩雷 钟掘 

机构地区：[1]School of Mechanical and Electrical Engineering, Central South University

出　　处：《中国有色金属学会会刊：英文版》2007年第3期606-611,共6页Transactions of Nonferrous Metals Society of China

基　　金：Projects(50390064, 50675227) supported by the National Natural Science Foundation of China;Project(2003CB716202) supported by the National Basic Research Program of China

摘　　要：During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based on those data, the relationship between ultrasonic power and bonding strength was studied. The results show that: 1) ultrasonic power is affected by ultrasonic power ratio and other uncontrolled factors such as asymmetric substrate quality, unstable restriction on the interface between wedge tool and aluminum wire; 2) when ultrasonic power is less than 1.0 W, increasing ultrasonic power leads to increasing bonding strength and decreasing failure bonding; on the contrary, when ultrasonic power is greater than 1.6 W, increasing power leads to decreasing bonding strength and increasing failure bonding; 3) only when ultrasonic power is between 1.0 W and 1.6 W, can stable and high yield bonding be reached. Finally, the microstructure of bonding interface was observed, and a ring-shaped bond pattern is founded in the center and friction scrape besides the ring area.During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based on those data, the relationship between ultrasonic power and bonding strength was studied. The results show that： 1） ultrasonic power is affected by ultrasonic power ratio and other uncontrolled factors such as asymmetric substrate quality, unstable restriction on the interface between wedge tool and aluminum wire; 2） when ultrasonic power is less than 1.0 W, increasing ultrasonic power leads to increasing bonding strength and decreasing failure bonding; on the contrary, when ultrasonic power is greater than 1.6 W, increasing power leads to decreasing bonding strength and increasing failure bonding; 3） only when ultrasonic power is between 1.0 W and 1.6 W, can stable and high yield bonding be reached. Finally, the microstructure of bonding interface was observed, and a ring-shaped bond pattern is founded in the center and friction scrape besides the ring area.

关 键 词：焊接强度 超声波技术 显微结构 焊接技术 

分 类 号：TB559[理学—物理]