硫酸盐酸性光亮镀锡铋合金工艺  

PROCESS OF SULFATE ACIDIC BRIGHT Sn-Bi ALLOY ELECTROPLATING

作　　者：易翔[1] 肖鑫[1] 钟萍[1] 陈帮[1] 

机构地区：[1]湖南工程学院化学化工系,湘潭411104

出　　处：《腐蚀与防护》2007年第4期183-185,共3页Corrosion & Protection

摘　　要：采用赫尔槽试验研究了硫酸盐酸性电镀锡铋合金工艺。以改善镀层的光亮性以及镀液的稳定性为目的,讨论了镀液组分及工艺条件对镀液和合金镀层性能的影响,检测了镀液和镀层的相关性能。结果表明:镀液中加入光亮剂和稳定剂后,可获得一种铋含量达2.5%,且耐蚀性、可焊性优良的光亮Sn-Bi合金镀层。镀液的覆盖能力和分散能力良好,镀液稳定性也得到较大提高。The process of acidic Sn-Bi alloy eleetroplating was developed by Hull cell tests. For improving bright appearance of the electroplated film and stability of the plating solution, the effect of the composition and operating condition on properties of the film and solution was discussed, and properties of the film were tested. The corrosion resistance, welding ability of the alloy coating obtained by adding stabilizer and brighter were excellent and the content of Bi in the coating was 2. 5%. The throwing power, covering ability and stability of the bath were good.

关 键 词：锡铋合金 赫尔槽试验 光亮性 稳定性 

分 类 号：TQ153.2[化学工程—电化学工业]