硫酸盐镀铜的故障分析及修复  

Trouble-Shooting Technology for Copper Electroplating from Sulfate Bath

作　　者：张业明[1] 陈志量[2] 郝龙[2] 刘桥阳[1] 林安[2] 甘复兴[2] 

机构地区：[1]黄石理工学院环境科学与工程学院,湖北黄石435003 [2]武汉大学资源与环境科学学院,湖北武汉430072

出　　处：《材料保护》2007年第7期67-69,共3页Materials Protection

摘　　要：依据"HullCell"和小槽试验以及对数家电镀厂多年的研究发现,硫酸铜镀层出现的表面缺陷、目视样板对比的光泽性较差或外观色泽不当、电沉积层覆盖能力不强等弊病,主要是由电镀生产管理不善、电镀液维护及添加试剂错误等造成的。针对电镀生产中典型的硫酸铜故障及电镀液经常出现的问题和镀层出现的缺陷,进行了多次试验和分析,并提出了相应的故障修复技术和电镀液维护措施。Based on the'Hull Cell'experiments and investigation of many years and research in some electroplating plants,it was found that the surface defects,poor glossiness in visual mould boards or abnormal visual brightness and lower electrolytic depositional covering capacity in copper sulfate plating were attributed to the mistakes in electrolyte maintenance and unsuitable additives caused by inappropriate electric plating plant supervision.In view of the typical inactions in electroplating production,the problems encountered in electrolyte,and the flaws in plating,proper trouble-shooting strategies for electric copper plating and electrolyte maintenance were offered after repeated experiments and careful ly comprehensive analysis.

关 键 词：电镀 硫酸盐镀铜 故障处理 电解液维护 

分 类 号：TQ153.14[化学工程—电化学工业]