薄膜封装型NTC热敏电阻器的研制  

Preparation of the insulation film type NTC thermistors

作　　者：袁国安 熊成勇 

机构地区：[1]广东风华高新科技股份有限公司热敏元器件分公司,广东肇庆526020

出　　处：《电子元件与材料》2007年第7期57-59,共3页Electronic Components And Materials

摘　　要：为适应电子整机产品狭窄空间安装的需要,NTC热敏电阻器(NTCR)要进行超薄设计。采用固相反应法制粉,压锭烧结制作NTCR芯片,焊接引线和薄膜封装等工艺方法实现产品的薄形化封装,研制出了一种阻值R25为10k?,材料常数B为3435K,产品最大厚度仅0.5mm的新型薄膜封装型NTC热敏电阻器,为家电产品和生产设备的轻薄化推出了一种新型NTC热敏电阻器。Adapting to NTC thermistor the narrow space in a complete set of equipment, the super-thin NTC thermistors were prepared. The NTCR powders were producted by solid phase reaction method. The NTCR chip were producted by the sintered NTC ingot method. The products were realized by lead soldered and insulation film coated. A kind of insulation film type NTC thermistor was developed. The characteristics of the products are： the resistance of 25℃ is 10 kΩ, the constant of material is 3 435 K, the maximum thickness is 0.5 mm. It is a new type NTC thermistor for the thinned and light-end electric household apparatus and production equipment.

关 键 词：电子技术 薄膜封装 NTC热敏电阻器 性能 超薄 可靠性评价 

分 类 号：TN37[电子电信—物理电子学]