聚合物基纳米复合材料热导率计算  

Calculation on Heat Conduction of Polymer Matrix Nano-composites

作　　者：闵新民[1] 安继明[1] 饶宝林[2] 吴伯麟[2] 

机构地区：[1]武汉理工大学理学院,武汉430070 [2]桂林工学院材料与化学工程系,桂林541004

出　　处：《武汉理工大学学报》2007年第7期26-29,共4页Journal of Wuhan University of Technology

基　　金：973预研(2005CCA00200)

摘　　要：讨论了聚合物基高导热高绝缘纳米复合材料的导热机理与常用的导热理论模型。考虑到填充率、温度等的影响,用不同的理论模型计算了氧化铝纳米颗粒填充环氧树脂的热导率,并结合相关研究实验对不同的导热理论模型进行分析比较。通过添加高导热填料可显著提高聚合物材料的热导率,且热导率随填料填充率的增大而显著增大。热导率随在300 K到373 K的范围内,复合材料的热导率随着温度的升高而增大;而当温度超过373 K,复合材料的热导率则随着温度的升高缓慢下降。The heat conduction mechanisms and theoretical models which were normally used in the high thermal conductivity polymer matrix nano-composites of polymer composites were discussed, To consider the effect of filling ratio, temperature and et al, the thermal conductivity of epoxy resin matrix composite filled with alumina nano-particles was calculated, and the resuits of the various theoretical models according to relative experimental results was analyzed and compared. It was shown that filling by the materials with excellent thermal conductivity can obviously enhance the thermal conductivity of the polymer matrix nano-composites, and the thermal conductivity increases with the filling ratio. The thermal conductivity increases with the temperature from 300 K to 373 K, but it slowly decreased with the temperature when it was higher than 373 K.

关 键 词：聚合物基 复合材料 导热模型 热导率 

分 类 号：O641.12[理学—物理化学]