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机构地区:[1]桂林工学院电子与计算机系 [2]上海大学机电工程与自动化学院,上海200072
出 处:《半导体技术》2007年第8期692-696,共5页Semiconductor Technology
基 金:广西自然科学基金项目(0447099)
摘 要:主要论述了在SOC产品开发中如何设计以太网MAC层IP软核。针对目前以太网MAC层IP软核设计的实际情况,分析了三种常用的IP软核设计方法的优缺点,提出了一种改进的U型IP软核设计方法。并运用此方法先对以太网MAC层IP软核进行层次化的自顶而下设计,再对其进行自底而上地实现与集成,最后得到该IP软核整体。经过对该软核的测试与结果分析,验证了其能够实现以太网MAC层协议功能,达到了设计目标。该研究将对今后的以太网MAC层IP软核及相关产品开发具有重要的参考价值。How to design the soft IP core of the Ethernet MAC layer in the development of SOC products was illustrated. According to the practical situations of the designs of present soft IP core of the Ethernet MAC layer, the advantages and disadvantages of the three types oft-used design of soft IP core were analysed, and a new proposal for the U type improvement design of soft IP core was proposed. Putting this method into practice, a hierachical top-down design of the soft IP core of the Ethernet MAC layer was made, then the soft IP core of the Ethernet MAC layer was implemented and integrated by bottom-up design. Finally the whole of the soft IP core was obtained. It proves that this soft IP core can fulfill its protocol in the Ethernet MAC layer after making a test on it and making an analysis of the testing results, thus the purpose of the design is achieved. This research will serve as quite important references to the future designs of the soft IP core of the Ethernet MAC layer and the correlation products.
分 类 号:TN47[电子电信—微电子学与固体电子学]
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