无铅银导电浆料  

Lead free silver conducting paste

作　　者：罗世永[1] 彭立春[1] 许文才[1] 郝燕萍[1] 

机构地区：[1]北京印刷学院印刷包装材料与技术北京市重点实验室,北京102600

出　　处：《化工新型材料》2007年第7期55-56,共2页New Chemical Materials

基　　金：北京市优秀人才培养资助项目(No.20061D0500400145);北京市教委科技发展计划资助项目(No.KM200610015002);北京市属市管高等学校人才强教-学术创新团队资助项目PHR(IHLB;17000168);硅酸盐材料工程教育部重点实验室(武汉理工大学)开放课题基金资助项目(No.SYSJJ2006-05)

摘　　要：以银粉、低熔无铅玻璃和乙基纤维素松油醇溶液制备了无铅银导电浆料。根据浆料中玻璃粉含量对烧结膜表面电阻、威氏硬度和附着力的影响结果,提出了银导电浆料的配方,测定研究了浆料的流变性。用玻璃转变温度为488℃、含量为5%（质量）的无铅低熔玻璃配制的浆料在540-590℃之间任一温度烧结后,外观致密光洁;膜厚为（15±3）μm时,表面方阻为2.3×10-3Ω/mm2,威氏硬度为61MPa,与玻璃基片的附着力为28.5MPa。The lead free silver conducting pastes were prepared by using silver powder, lead free low-melting glass and terpineol ethyl cellulose solution. By analyzing the sheet resistance, Vickers hardness as well as the adhesion strength of the sintered film on the varying of the glass content in the paste, the composition of the paste was given. Also, the theological behavior of the paste were investigated by using a ARES（RFS-fII）rheometers. The films, prepared by the paste using the lead free glass of 5 % with a glass transition temperature of 488℃, were perfectly flat and compact after fired at a peak temperature within the range from 540℃ to 590℃, which is applicable for manufacturing electrical components on glass substrate. The sheet resistance of the fired film with glass content of 5 % was 2. 3×10^-3Ω/mm^2 at the thickness of （15±3）±m,while the Vickers hardness was 61MPa,and the binder force was 28.5MPa.

关 键 词：无铅银导电浆料 无铅低熔玻璃含量 表面方阻 附着力 威氏硬度 流变性 

分 类 号：TM242[一般工业技术—材料科学与工程]