基于CFD的电子器件散热最优间距的数值研究  

Numerical Research on the Optimum Space of Heat Dissipation for Electronic Elements by CFD Methods

作　　者：云和明[1] 程林[1] 

机构地区：[1]山东大学空间热科学技术中心,济南250061

出　　处：《电子器件》2007年第4期1181-1183,1187,共4页Chinese Journal of Electron Devices

基　　金：国家973计划项目(2007CB206900)

摘　　要：为研究高发热功率电子器件散热的机理,采用CFD技术对小空间内电子器件的散热状况进行了研究,模拟了以空气为冷却流体多种电子器件间距条件下小空间的温度场及速度场.以电子器件冷却后的温度水平、平均换热系数、流动阻力为主要因素,并结合场协同理论提出一种评价电子器件冷却效果的评判公式,进而以它为指标得出电子器件散热效果的最优间距.To investigate the heat dissipation mechanism of electronic elements with high heat generation power, the heat dissipation of electronic elements in a mini-space is investigated by using Computational Fluid Dynamics （CFD） methods. The velocity and temperature fields of mini-space are simulated on the condition of several schemes of different space between them with air as fluid. A cooling effect number has been put forward to evaluate the cooling effects of electronic elements in combination with coordination principle and with the temperature level ,average heat transfer coefficients, flow resistance as main factors for electronic elements after cooling. Then the optimum space of heat dissipation for electronic elements has been obtained by comparing the cooling effect number of different schemes.

关 键 词：电子冷却 热设计 CFD 场协同 

分 类 号：TK124[动力工程及工程热物理—工程热物理]