低黏度环氧树脂性能研究  

Study on performance of low viscosity epoxy resin

作　　者：段华军[1] 张联盟[1] 王钧[1] 杨小利[1] 

机构地区：[1]武汉理工大学材料科学与工程学院,湖北武汉430070

出　　处：《粘接》2007年第4期4-6,共3页Adhesion

基　　金：湖北省自然科学基金项目(2006ABA321)

摘　　要：对自制低黏度环氧树脂的黏度特性、固化特性、浇铸体的力学性能、耐热性以及复合材料的电性能进行了测试与分析。结果表明,该低黏度环氧树脂在常温下具有很低的黏度(120 mPa.s)和较长的适用期;在中温(80℃)条件下即可凝胶,固化产物力学性能和电性能优异,耐热性良好。The performance of self-made low viscosity epoxy resin was measured and analysed. The performance included the viscosity, curing property, the mechanical and heat resisting properties of casting materials, and the electrical properties for composite materials. The results showed that the epoxy resin had good fluidity with viscosity value of 120mPa. s at room temperature, the gel phenomena took place at medium temperature（80℃） and its cured product showed excellent mechanical, electrical and heat resisting properties.

关 键 词：黏度特性 力学性能 玻璃化转变温度 绝缘性能 介电性能 环氧树脂 

分 类 号：TQ433.437[化学工程]