降低阳极连接中残余应力的措施  

Measures of Lowing Residual Stress in Anodic Bonding

作　　者：刘子建[1] 刘翠荣[1] 孟庆森[2] 

机构地区：[1]太原科技大学,山西太原030024 [2]太原理工大学,山西太原030024

出　　处：《铝加工》2007年第4期46-48,共3页Aluminium Fabrication

摘　　要：简要介绍了阳极连接的机理、应用范围、残余应力的存在对键合质量的影响,分析了残余应力产生的因素,提出了降低这些因素影响的措施。The mechanism of anodic bonding, application area and the effect of residual stress were introduced in the paper, andthe corresponding measures were also put forward to decrease the residual stress in anodic bonding.

关 键 词：残余应力 金属厚度 热膨胀系数 温度 冷却速度 

分 类 号：TG404[金属学及工艺—焊接]