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机构地区:[1]郑州航天电子技术有限公司,河南驻马店463000
出 处:《模具技术》2007年第4期27-29,共3页Die and Mould Technology
摘 要:通过对插孔绝缘体结构及成型工艺要求的分析,介绍了一种利用顶板顶出及模具设计中采用型芯对接结构的工艺难点分析。指出了模具设计结构特点和设计要点,并提出了制造过程中应注意的问题及解决方法,提高了产品质量和模具制造质量。Difficulty of using injection plate and adoption of core butting structure was introduced by analyzing forming process requirement and structure of socket insulator. Features and key points of die design were pointed out. Attention should be paid during manufacturing and solutions of difficulties were also proposed. By using proposed method, both product and die manufacturing quality were improved.
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