三维多孔锡薄膜的电沉积制备  

Electrodeposition of three-dimensional porous tin films

作　　者：周颖华[1] 岑树琼[1] 邵玉田[1] 牛振江[1] 李则林[1] 

机构地区：[1]浙江师范大学物理化学研究所浙江省固体表面反应化学重点实验室

出　　处：《浙江师范大学学报（自然科学版）》2007年第3期307-313,共7页Journal of Zhejiang Normal University:Natural Sciences

基　　金：浙江省自然科学基金资助项目(Y404028)

摘　　要：应用阴极析氢气泡模板法在酸性硫酸亚锡溶液中电沉积制备三维多孔锡薄膜，并研究了电流密度、锡离子浓度、沉积时间以及添加剂苯甲醛和聚乙二醇辛基苯基醚（OP）等对薄膜孔径大小和孔壁结构的影响．结果表明，在电流密度为1．0～8．0A·cm^-2时薄膜的孔径和孔壁结构无明显变化，提高锡离子浓度可使薄膜的孔径和孔壁厚度增加，苯甲醛和OP可显著改变薄膜的孔径和孔壁结构．Using cathodic hydrogen bubbles as templates, three dimensional （3-D） porous tin films had been successfully electrodeposited from a bath of 0.05 mol · dm^-3 SnS04, 1.5 mol · dm^-3 H2SO4 and the influence of deposition parameters including the concentration of Sn^2＋ , current density, additives phenyl aldedyde, p-octyl polyethylene phenyl ether （ OP） on the structure and morphologies of the deposits had been systematically investigated. The results showed that the concentration of Sn^2＋ can influence the morphologies of the foam deposits, whereas current density in region of 1.0 - 8.0 A · cm^-2 had little effect. The additives can profoundly change the pore size and structure of the wall of the 3-D tin films.

关 键 词：气泡模板法 电沉积 多孔锡 孔径 孔壁结构 

分 类 号：O646.54[理学—物理化学]