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作 者:岳灿甫[1] 王永朝[1] 郭海霞[1] 雷竹芳[1] 陈会东[1]
出 处:《材料开发与应用》2007年第4期7-10,共4页Development and Application of Materials
摘 要:采用内氧化法用雾化铜铝合金粉制备出了铝含量(质量分数)分别为0.15%、0.25%、0.35%的3种氧化铝弥散强化铜合金.研究了Al2O3弥散强化铜合金的组织与性能.结果表明,弥散铜合金的晶粒细小,晶粒大小在0.2~1μm之间;内氧化工艺生成的细小氧化铝质点在晶粒内部呈弥散分布,其平均直径小于20nm.0.35%Al含量的弥散强化铜合金抗拉强度为600MPa,电导率为83%IACS,满足了CuCrZr电阻焊电极的要求,可以作为CuCrZr电阻焊电极的替代材料.Series of aluminum oxide dispersion strengthened copper alloy (ODSC) containing 0.15%,0.25% and 0.35% Al (wt%) are produced from atomized Cu-Al powder through internal oxidation. Tensile strength and conductivity of the copper alloy with 0.35 % Al are 600 MPa, 83 % IACS respectively, meeting the requirement for electrode in resistance welding, as a substitute for CuCrZr electrode. The rnicrostructure and property of the alloy is researched. The result shows that the grain of the ODSC alloy is very small with a size between 0.2- 1.0μm. The fine Al203 particle is distributed dispersedly in grains. Its average diameter is less than 20 nanometer.
分 类 号:TB331[一般工业技术—材料科学与工程]
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