电沉积铜薄膜中的内应力与织构特征  

CHARACTERISTIC OF INTERNAL STRESS AND TEXTURE IN ELECTROPLATED COPPER THIN FILMS

作　　者：洪波[1] 姜传海[1] 王新建[1] 

机构地区：[1]上海交通大学材料科学与工程学院高温材料及高温测试教育部重点实验室,上海200240

出　　处：《理化检验（物理分册）》2007年第8期392-394,共3页Physical Testing and Chemical Analysis(Part A:Physical Testing)

基　　金：上海-应用材料科技合作基金(0412)

摘　　要：利用X射线衍射方法分析了电沉积铜薄膜的内应力及其织构特征。结果表明,随薄膜厚度的增加,薄膜内应力增大。电沉积铜薄膜具有较强的(220)丝织构,随着铜薄膜内应力的增加,(220)丝织构增强,同时叠加有板织构的特征。The characteristic of texture and internal stress of electroplated copper thin films were studied using X-ray diffraction （XRD） analysis. The results showed that the electroplated copper thin films had highly preferred orientations of （220）. The （220） fiber-texture of copper thin films became strong with increasing internal stress. At a critical film thickness, the copper thin films exhibited character of planar texture.

关 键 词：电沉积铜薄膜 X射线衍射 内应力 织构 

分 类 号：O484.2[理学—固体物理]