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作 者:宋春梅[1]
出 处:《遵义师范学院学报》2007年第4期57-59,共3页Journal of Zunyi Normal University
基 金:贵州省科技厅基金20052088
摘 要:采用机械合金化法在553K、6Gp下压制30分钟获得Bi_(0.85)Sb_(0.15)+x%Te(其中,x=0.1、0.2、0.5、1和2)的纳米晶热电材料,并对Bi_(0.85)Sb_(0.15)+x%Te材料的热电性能进行了研究。通过对样品的X-ray衍射实验分析,证实已形成了单相合金。在80-300K温区测量了样品的Seebeck系数、热导率和电导率,并计算出材料的优质参数。结果表明:Bi_(0.85)Sb_(0.15)+x%Te材料在80-300K温区表现出金属特征。Bi_(0.85)Sb_(0.15)+0.1%Te样品的电导率要比Bi_(0.85)Sb_(0.15)样品电导率高2-3倍,而Seebeck系数绝对值比Bi_(0.85)Sb_(1.15)样品减少了近80%。表明掺入Te可以提高Bi_(0.85)Sb_(0.15)纳米晶粉末材料的电导率。Nano erystallite Bi0.85Sb0.15+x%Te (x=0.1,0.2,0.5 and 2)powders were prepared by mecbanical alloying method. The powders were pressed into pellets and then pressed to form bulk samples under high pressure of 6 GPa at 553K for 30 minutes. The X-ray diffraction analysis indicated that single phase was formed. Seebeck coefficient, electrical conductivity and thermal conductivity were measured in the temperature range of 80-300 K. The figure-of-merits of all samples were calculated. All samples show the feature of metal. The electrical conductivity of Bi0.85Sb0.15+0.1% Te is 2-3 times larger than that of Bi0.85Sb0.15, however, the Seebeck coefficient of Bi0.85Sb0.15+0.1% Te is 80% lower than that of Bi0.85Sb0.15.The resuits shows that dopant of Te can improve the electrical conductivity of Bi0.85Sb0.15.
分 类 号:O511.3[一般工业技术—材料科学与工程]
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