Ni+Cu为中间层的TC4与ZQSn10—10的扩散连接试验分析  

Diffusion bonding of TC4 to ZQSn10-10 with nickel and copper interlayers

作　　者：元哲石[1] 徐立新[2] 吴执中[1] 宋敏霞[1] 赵涣凌[1] 

机构地区：[1]吉林大学材料科学与工程学院,长春130022 [2]河南机电高等专科学校,河南新乡453002

出　　处：《焊接学报》2007年第8期92-95,共4页Transactions of The China Welding Institution

摘　　要：对钛合金TC4与铜合金ZQSn10-10异种金属扩散连接进行了试验研究。采用Ni+Cu中间层时,其最佳工艺参数为连接温度850℃,连接时间20min,连接比压力10MPa,抗拉强度达到155.8MPa。在TC4/Ni界面上,形成了成分逐渐变化的互扩散层。经微区成分分析可知,连接温度为800℃时,界面主要为Ni3Ti;850℃时,界面主要为Ni3Ti及NiTi;880℃时,界面主要为NiTi2,Ni3Ti及NiTi。通过EDS和XRD分析,接头强度主要取决于镍钛金属间化合物的种类及厚度。The experimental investigation of the diffusion bonding of TC4 to ZQSn10-10 in vacuum was carried out by using pure nickel and copper as the transition metal. Experimental results show that the optimum bonding parameters were selected as follows: bonding temperature 850 ℃, bonding time 20 min and bonding pressure 10 MPa. So the strength of the joint without obvious shape changing was up to 155.8 MPa, which the strength can reach to about 65% of the strength of base metal ZQSn10-10. Various reaction layers appeared in TC4 and Ni interface. When the rest condition was same, Ni3Ti phase was produced at the interface zone at 800 ℃;and there appeared Ni3Ti and NiTi phases at 850 ℃; and there produced NiTi2,Ni3Ti and NiTi phases at 880 ℃. The strength of the joint lied on types and thickness of nickel and titanium intermetallic compounds.

关 键 词：钛合金 锡青铜 扩散连接 Ni+Cu中间层 金属间化合物 

分 类 号：TG457.1[金属学及工艺—焊接]