耐高温、低导热、柔性微孔硅酸钙材料的研究  被引量:5

Study of Flexible Micro-Porous Calcium Silicate with High-Temperature Resistance and Low Thermal Conductivity

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作  者:石兴[1] 李懋强[1] 

机构地区:[1]中国建筑材料科学研究总院高性能陶瓷及精细工艺实验室,北京100024

出  处:《稀有金属材料与工程》2007年第A01期560-563,共4页Rare Metal Materials and Engineering

摘  要:通过二次成型工艺,以微孔硅酸钙颗粒和硅酸铝陶瓷纤维为主要原料,制成了柔性微孔硅酸钙材料(记为CS/AS),在1000℃时,导热系数为0.106W/(m·K),而最高使用温度为1100℃。在200℃以下,CS/AS可以保持相当强度和柔性。常温抗拉强度约为1MPa,200℃时,抗拉强度约为0.6MPa,而柔性弯曲半径为3mm。通过扫描电镜可以看到CS/AS中有大量孔径小于10μm的微孔,孔隙大小和孔隙半径分布决定了CS/AS的绝热性能。Flexible micro-porous calcium silicate (CS/AS), made of micro-porous calcium silicate particles and aluminum silicate fiber by post forming process, has low thermal conductivity. At 1000 ℃ its thermal conductivity is of 0.106 W/(m.K). Its maximum woking temperature can be as high as ll00 ℃, and there are few drops in strength and flexibility when the temperature keeps below 200 ℃. Its tensile strength is 1 MPa at room temperature. At 200 ℃ its tensile strength is 0.6 MPa and its flexural bending radius is 3 ram. It can be found by SEM that the CS/AS has a large amount of small pores. The pore size and its distribution decide the performances of the CS/AS insulation material.

关 键 词:微孔硅酸钙 硅酸铝纤维 柔性绝热材料 

分 类 号:TU551[建筑科学—建筑技术科学]

 

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