SiC多孔陶瓷的低温制备与表征  

Low-Temperature Fabrication and Characterization of Porous SiC Ceramics

作　　者：于晓东[1] 王扬卫[1] 马青松[2] 马彦[2] 陈朝辉[2] 

机构地区：[1]北京理工大学材料科学与工程学院材料加工系,北京100081 [2]国防科技大学新型陶瓷纤维及其复合材料国防科技重点实验室,湖南长沙410073

出　　处：《稀有金属材料与工程》2007年第A01期587-589,共3页Rare Metal Materials and Engineering

基　　金：武器装备预研基金资助项目(51488030104BQ0101)

摘　　要：以聚碳硅烷为粘接剂,SiC粉末为骨料,经模压成型、惰性气氛保护下于1000℃裂解低温制得SiC多孔陶瓷。考察了聚碳硅烷含量、SiC粉末粒径、模压压力、造孔剂碳含量等参数对多孔陶瓷孔隙率、弯曲强度、孔结构的影响。结果表明,随着聚碳硅烷含量和模压压力的增加,SiC多孔陶瓷的开口孔隙率下降,弯曲强度升高;随着造孔剂碳含量的增加,多孔陶瓷的孔隙率由53.05%升高至58.6%,抗弯曲强度迅速由7.88MPa下降到1.08MPa。随着模压压力的升高,多孔陶瓷的平均孔径下降;随着SiC粉末粒径的增加,平均孔径增大。Porous SiC were prepared using SiC powders and polycarbosilane （PCS） as binder. During pyrolysis, PCS experienced an organic-inorganic transformation and bonded SiC powders at a low temperature of 1273 K. The flexural strength of porous SiC ceramics increased with increasing PCS content and shaping pressure, while decreased with increasing the carbon content. With the increasing of the content of carbon, the open porosity of SiC ceramics increased from 53.05% to 58.60%, while the flexural strength decreased from 7.88 MPa to 1.08 MPa. The average pore size of porous SiC ceramics decreased with increasing shaping pressure and decreasing particle size of SiC powders.

关 键 词：SIC多孔陶瓷 聚碳硅烷 陶瓷先驱体裂解 孔结构 弯曲强度 

分 类 号：TB383.4[一般工业技术—材料科学与工程]