Cu-Ti_3AlC_2金属陶瓷的制备及性能研究  

Fabrication and Properties of Cu-Ti_3AlC_2 Cermet

作　　者：梁胜国[1] 翟洪祥[1] 艾明星[1] 黄振莺[1] 

机构地区：[1]北京交通大学机械与电子控制工程学院,北京100044

出　　处：《稀有金属材料与工程》2007年第A01期668-670,共3页Rare Metal Materials and Engineering

基　　金：国家自然科学基金资助项目(50472045);国家"863"计划资助项目(2003AA33208);北京交通大学博士生科技创新基金(48014)

摘　　要：用无压浸渗法制备了铜-钛铝碳金属陶瓷材料(Cu-Ti3AlC2)。研究了Cu含量对反应产物的影响,测试了制备的Cu-Ti3AlC2样品的抗弯强度、硬度和导电率,并进行了显微结构观察和断口分析。结果表明,在适当的工艺条件下,当Cu含量在一定范围内,经无压烧结可获得高致密性的Cu-Ti3AlC2陶瓷块体材料。由于其特殊的显微结构,所制备的Cu-Ti3AlC2样品在保证导电率的同时其室温抗弯强度、硬度都大大超过单相钛铝碳陶瓷。Cu-TiAlC2 cermet was fabricated by pressureless sintering power mixtures of Cu and Ti3AlC2. The effect of Cu content on reaction product was studied. The fracture strength, Vickers hardness and conductivity of Cu-TiAlC2 were investigated. And the microstructure and fracture face were observed and analyzed. The experimental results showed that, under the proper condition, Ti3AlC2 bulks with high-density were fabricated by pressureless sintering when the content of Cu was in a certain range. Much higher fracture strength and Vickers hardness can be attributed to the special microstructure of Cu-TiAlC2.

关 键 词：Cu-Ti3AlC2 制备工艺 显微结构 材料特性 

分 类 号：TG148[一般工业技术—材料科学与工程]