不同工艺对SiC/Cu复合材料界面结合的影响  

Effect of Different Processes on SiC/Cu Composites Interface Bonding

作　　者：黎寿山[1] 王海龙[1] 刘瑞瑜[1] 范冰冰[1] 王春华[1] 吴曰送[1] 张锐[1] 

机构地区：[1]郑州大学材料科学与工程学院,河南郑州450001

出　　处：《稀有金属材料与工程》2007年第A01期689-691,共3页Rare Metal Materials and Engineering

摘　　要：采用包裹法和机械合金法制备了SiC:Cu为20:80(体积比)的SiC/Cu复合材料。采用XRD,SEM及EDAX能谱对粉体和烧成样品的物相、断口显微形貌及断口物质成分进行了表征。结果表明:采用包裹法在制备复合粉体过程中出现Cu2O,其含量在烧结过程中减少,包裹法制备的烧成样品SiC颗粒和Cu结合成"核-壳"结构,两相分布比机械合金法更均匀,界面结合更好,强度更高。The SiC/Cu composites were prepared by the coating method and mechanical alloy method. The phase, the cross-section micromorphology and component of the powders and the sintered samples were characterized by XRD, SEM and EDAX. The results indicate that the inherent Cu20 was found in the powders during the coating process and its content decreased during the sintering process. SiC particles and Cu formed a core-shell structure in the sintered samples by coating, whose two phase distribution was more homogeneous than that of the samples prepared by mechanical alloy method, as well as better interfacial bonding and higher strength.

关 键 词：包裹法 机械合金法 SIC/CU复合材料 

分 类 号：TB333[一般工业技术—材料科学与工程]