Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process  被引量:9

Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process

在线阅读下载全文

作  者:XU Rongchang TANG Di REN Xueping WANG Xiaohong WEN Yonghong 

机构地区:[1]National Engineering Research Center for Advanced Rolling Technology, University of Science and Technology Beijing, Beijing 100083, China

出  处:《Rare Metals》2007年第3期230-235,共6页稀有金属(英文版)

基  金:the National Natural Science Foundation of China (No. 50375019).

摘  要:The matrix accumulative roll bonding technology (MARB) can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope (SEM) and energy-dispersive spectroscopy (EDS). The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.The matrix accumulative roll bonding technology (MARB) can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope (SEM) and energy-dispersive spectroscopy (EDS). The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.

关 键 词:matrix accumulative roll bonding Cu/Al composite material interface bonding diffusion annealing 

分 类 号:TG14[一般工业技术—材料科学与工程]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象