聚硅氧硅氮烷改性烯丙基酚醛杂化树脂的研究  

Study on polysiloxazane/allyl phenolic hybrid resins

作　　者：郑知敏[1] 胡继东[1] 赵彤[1] 罗永明[1] 徐彩虹[1] 谢择民[1] 

机构地区：[1]中国科学院化学研究所,北京100080

出　　处：《有机硅材料》2007年第5期253-257,共5页Silicone Material

基　　金：国家自然科学基金资助项目(50403027)。

摘　　要：采用二苯基硅二醇与含乙烯基的聚硅氮烷(SiN08)反应,合成了三种含二苯基硅氧链节的聚硅氧硅氮烷MPSZ-1、MPSZ-2、MPSZ-3;并用于烯丙基酚醛(AP)树脂的改性。与纯AP树脂相比,聚硅氧硅氮烷改性烯丙基酚醛树脂(MPSZ/AP)的热分解温度和高温残余质量分数都有较大提高。在N2气氛中,AP的质量损失率为5%时的温度为383℃,900℃残余质量分数为33.0%;MPSZ-1/AP的质量损失率为5%时的温度为465℃,900℃残余质量分数为74.4%。在空气气氛中,AP的900℃残余质量分数仅1.5%,MPSZ-1/AP的900℃残余质量分数为33.8%。MPSZ-1/AP体系的热分解温度和高温残余质量分数与SiN08/AP体系相当,而其固化质量损失率较低,仅为4.4%,适合采用树脂传递模塑(RTM)成形工艺制成复合材料。对聚硅氮烷/AP树脂固化过程的初步研究表明,Si—N键在固化过程中起主要作用。Three types of polysiloxazanes MPSZ-1,MPSZ-2 and MPSZ-3 were synthesized by the reaction of diphenyldihydroxylsilane and polysilazane (SiN08) with allyl phenolic (AP) resin. Compared with pure AP resin,the thermal decomposition temperature and residue weight at 900 ℃ of hybrid polysiloxazane/allyl phenolic resins was greatly increased. Under N2 atomosphere,the temperature at 5% weight loss of pure AP resin was 383 ℃,and residue weight at 900 ℃ 33.0%,while that of MPSZ-1/AP was 465 ℃ and 74.4% respectively. The thermal decomposition temperature and residue weight at 900 ℃ of MPSZ-1/AP were similar to that of SiN08/AP,but with less weight loss of 4.4% during curing,which was advantageous for fabrication of composites in resin transfer molding (RTM) process.The curing of polysilazane/AP was investigated by DSC,which showed that Si—N bond played key roles in crosslinking.

关 键 词：聚硅氧硅氮烷 烯丙基酚醛树脂 杂化树脂 二苯基硅二醇 

分 类 号：TQ320.1[化学工程—合成树脂塑料工业]