化学镀镍磷合金“配位催化机理”探讨  

Discussion on "Coordination Catalysis Mechanism" for Electroless Ni-P Alloy Plating

作　　者：曲志涛[1] 

机构地区：[1]广东轻工职业技术学院轻化工程系,广东广州510300

出　　处：《电镀与环保》2007年第5期19-22,共4页Electroplating & Pollution Control

摘　　要：以配位催化理论对化学镀镍过程加以分析,着重提出了配位中心原子Fe或Ni对H2PO2-的配位催化作用;H2PO2-配位吸附生成金属氢化物,并释放活性氢,其它配位剂、促进剂等添加剂中配位分子与金属原子配位一般可以减弱H2PO2-与Fe或Ni间的σ键,更易提供活性氢;P的沉积是金属Ni在其表面通过配位将次磷酸吸附并还原成PH3,PH3能够紧密地吸附在金属Ni表面,并将吸附在金属Ni表面的H2PO2-还原生成P,并与Ni共沉积。The process of electroless nickel plating is analyzed with coordination catalysis theory. It is emphatically put forward that coordination center atom Fe or Ni has a coordination catalysis role on H2PO2^- ; H2PO2^- forms metal hydride through coordination absorption, and release active H, and the coordination of coordinating molecules of other additives, such as coordination agent, accelerating agent, etc. with metal atoms can weaken the σ bond between H2 PO2 and Fe or Ni, and can provide active H more easily; the sediment of P is the result that metal Ni absorbs hypophosphorous acid on its surface through coordination and is reduced to form PH3 , which can be absorbed closely on the surface of metal Ni, and reduce the H2 PO2^- adsorbed on the surface of metal Ni to form P and codeposite with Ni.

关 键 词：化学镀镍 配位 催化 机理 

分 类 号：TQ153[化学工程—电化学工业]