TiB_2对铜-石墨基复合材料性能的影响  

Effect of TiB_2 on the Property of C-Cu Matrix Composites

作　　者：袁传勇[1] 许少凡[1] 张中宝[1] 赵清碧[1] 

机构地区：[1]合肥工业大学,安徽合肥230009

出　　处：《稀有金属快报》2007年第9期31-34,共4页Rare Metals Letters

摘　　要：TiB2与铜-石墨基复合材料的界面结合及TiB2在基体中的分布是影响复合材料性能的重要因素。为提高材料的强度和电导率,用镀铜TiB2制备复合材料。通过金相显微镜和扫描电镜观察材料的显微组织,并测试其电导率。结果表明,在粒度细小的镀铜TiB2表面均匀包覆金属铜,在压制压力和烧结温度合适的条件下,复合材料的组织均匀,致密性好,TiB2在铜-石墨基体中弥散分布,铜基体形成连续三维网络结构,这种组织形态使复合材料的电导率和强度明显提高。The interface between TiB2 and graphite-Cu as well as distributed state is a very important factor to affect the property of graphite-Cu composites. In this paper the graphite-Cu composites are made from copper-coated-TiB2. By means of the analyses of SEM and metallograph and physical tests, the microstructure and properties of the composites made from copper-coated-TiB2 have been studied. The results show that at suitable compacting pressure and sintering temperature, the composite has a homogeneous structure and a high density with dispersive TiB2 and 3-D net structure of copper matrix in the graphite-Cu. The conductivity and hardness of the composites with this structure was improved remarkably.

关 键 词：TIB2 复合材料 导电性 镀铜TiB2 

分 类 号：TB331[一般工业技术—材料科学与工程]