电沉积法制备Ni-Ti_3SiC_2复合镀层  

Preparation of Ni-Ti_3SiC_2 Composite Coating by Electrodeposition

作　　者：韩若冰[1] 石随林[1] 吴瑞芬[1] 潘伟[1] 

机构地区：[1]清华大学新型陶瓷与精细工艺国家重点实验室,北京100084

出　　处：《稀有金属材料与工程》2007年第A02期684-686,共3页Rare Metal Materials and Engineering

基　　金：国家自然科学基金委员会资助(50232020;50572042)

摘　　要：以自制纯度超过98%(体积分数,下同)的Ti_3SiC_2陶瓷粉体为原料,加入分散剂和表面改性剂,制成稳定悬浮液,并加入Watts镀镍电镀液,利用磁力搅拌分散均匀,在阴极电流密度2A/dm^2～5A/dm^2下,在低碳钢基体表面成功得到Ni-Ti_3SiC_2减摩复合镀层。SEM观察表明,表面改性剂的加入有效地改变了粉体表面电导性质,得到致密平整的复合镀层结构。XRD及EDS分析表明:镀层中Ti_3SiC_2微粒含量为5%～14%(体积分数,下同)。当制备过程中以间歇式搅拌代替连续搅拌时,可得到Ti_3SiC_2相含量超过30%的复合镀层。复合镀层的显微硬度随微粒含量的升高而增大。Ni-Ti3SiC2 composites coating was co-deposited on a steel substrate by DC electrodeposition. 98 vol. % purity Ti3SiC2 ceramic powder pretreated with surfactant was added into a Watts＇ nickel plating bath, and stirred by magnetic stirring. Composite coating was fabricated at a cathode current density of 2 A/dm^2-5 A/dm^2. Surface patterns of the samples were observed by scaning electron microscope （SEM）. XRD and EDS were used for a study of coating structure and component. Over 30 vol.% Ti3SiC2 particle was co-deposited within nickel plating by a intermittent stirring. The micro hardness of the composites coating was also studied, which was increased with the increasing Ti3SiC2 particle content.

关 键 词：复合镀层 TI3SIC2 电沉积 表面改性 

分 类 号：TG174.4[金属学及工艺—金属表面处理]