Modeling and Control of Time-pressure Dispensing for Semiconductor Manufacturing  

作　　者：Cong-Ping Chen Han-Xiong Li Han Ding 

机构地区：[1]School of Mechanical Engineering, Huazhong University of Science ＆ Technology, Wuhan 430074, PRC [2]Department of Manufacturing Engineering and Engineering Management, City University of Hong Kong, Hong Kong 999077, PRC

出　　处：《International Journal of Automation and computing》2007年第4期422-427,共6页国际自动化与计算杂志（英文版）

基　　金：This work was supported by National Natural Science Foundation of China (No.50390063,50390064);the National Basic Research Program of China (973 Program) (No.2003CB716207).

摘　　要：To improve the consistency of the adhesive amount dispensed by the time-pressure dispenser for semiconductor manufacturing, a non-Newtonian fluid flow rate model is developed to represent and estimate the adhesive amount dispensed in each cycle. Taking account of gas compressibility, an intelligent model-based control strategy is proposed to compensate the deviation of adhesive amount dispensed from the desired one. Both simulations and experiments show that the dispensing consistency is greatly improved by using the model-based control strategy developed in this paper.To improve the consistency of the adhesive amount dispensed by the time-pressure dispenser for semiconductor manufacturing, a non-Newtonian fluid flow rate model is developed to represent and estimate the adhesive amount dispensed in each cycle. Taking account of gas compressibility, an intelligent model-based control strategy is proposed to compensate the deviation of adhesive amount dispensed from the desired one. Both simulations and experiments show that the dispensing consistency is greatly improved by using the model-based control strategy developed in this paper.

关 键 词：Time-pressure dispensing CONSISTENCY fluid flow rate model model-based control. 

分 类 号：TN3[电子电信—物理电子学]