热固性聚酰亚胺的研究进展及其在印制电路板上的应用  

Recent Advances in Thermosetting Polyimide and Its Applications in Printed Circuit Board

作　　者：庄永兵[1] 范和平[1] 

机构地区：[1]湖北省化学研究院,湖北武汉430074

出　　处：《化学与粘合》2007年第5期351-357,共7页Chemistry and Adhesion

摘　　要：热固性聚酰亚胺作为一类先进的基体树脂,在航空航天、印制电路板、高温绝缘材料等领域的应用不断扩大。相对于热塑性聚酰亚胺来说,热固性聚酰亚胺具有更好的可加工性能。而且,其加工窗口温度可通过变换不同反应性端基来实现。若选用合适的反应性端基,其在固化时无小分子挥发物放出。对热固性聚酰亚胺的研究现状分类作了综述,对降冰片烯、烯丙基降冰片烯、乙炔基、苯乙炔基、马来酰亚胺、苯基马来酰亚胺、苯并环丁烯等封端型热固性聚酰亚胺的研究进展进行了重点阐述,对它们结构与性能的关系、齐聚物的固化机理等进行了讨论,并对其在印制电路板上的应用和发展趋势作了概述和展望。Thermosetting polyimides are being developed for use as matrix resins in structurally efficient advanced composites in aircraft, electronic/ electrical materials for printed circuit board （ PCB ） and thermal insulation materials. Many different chemical approaches have been used to synthesize thermosetting polyimide resins which are easier to process than their thermoplastic counterparts. Furthermore, melt processing window can be adjusted by using different reactive groups. With appropriate reactive sites, no volatile is released during curing. In this article, recent advances in thermosetting polyimide resin are presented. Some end capped polyimides are detailed, such as nadimides and allyl nadic - imides, acetylene and phenylacetylene terminated polyimides, bismaleimides and maleimide functionalized polyimides, phenylmaleimide end capped polyimide, benzocyclobutenes, etc. Their relationships between structures and properties and thermal curing mechanisms of different oligomer are presented. Their development trend and applications in PCB are summarized.

关 键 词：热固性聚酰亚胺 基体树脂 印制电路板 应用 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]