弱碱性条件下紫铜化学抛光新工艺  

A NEW TECHNOLOGY FOR CHEMICAL POLISHING OF COPPER IN WEAK ALKALINE SOLUTION

作　　者：井涛[1] 张忠诚[1] 李广武[1] 赵芳[1] 

机构地区：[1]山东大学化学与化工学院,济南250061

出　　处：《腐蚀科学与防护技术》2007年第5期367-370,共4页Corrosion Science and Protection Technology

摘　　要：开发出了弱碱性溶液中紫铜化学抛光新工艺,确定了抛光液中的光亮剂(包括缓蚀剂和表面活性剂).经过一系列正交实验,获得了最佳工艺条件,并分析了影响抛光效果的各种因素.该工艺抛光速度快、腐蚀性低、环境污染小、成本低.A new technology for chemical polishing of copper in weak alkaline solution has been developed and a brightener （containing corrosion inhibitor and surfactant） has been found out. The process parameters have been optimized through the orthogonal trial, each influence factor has been analyzed. The new technology has advantages of fast polishing rate, low corrosion rate, less environmental pollution and low cost.

关 键 词：紫铜 弱碱性溶液 光亮剂 缓蚀剂 表面活性剂 

分 类 号：TG175.3[金属学及工艺—金属表面处理]