笼型倍半硅氧烷(POSS)/环氧杂化树脂体系固化反应动力学及性能研究  

Study on the curing kinetics and properties of polyhedral oligomeric silsesquioxane(POSS)/epoxy hybrid resin system

作　　者：张增平[1] 梁国正[1] 刘继三[1] 谢建强[1] 管兴华[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710072

出　　处：《中国胶粘剂》2007年第9期1-4,共4页China Adhesives

基　　金：西北工业大学研究生创业种子基金(Z200766)

摘　　要：为了提高环氧树脂的耐热性,采用笼型倍半硅氧烷(POSS)改性双酚A型环氧树脂E51,得到有机无机杂化树脂。采用Ozawa和Kissinger两种方法研究了杂化树脂/4,4′-二氨基苯砜(DDS)体系的固化反应动力学。TGA分析表明,POSS的加入提高了E51/DDS固化树脂体系的热性能。In order to enhance the thermal resistance of epoxy resin,diglycidyl ether of bisphenol A （E51） was modified by polyhedral oligomeric silsesquioxane （POSS）to form organic-inorganic hybrid resin. The curing kinetics of the obtained POSS/E51/DDS hybrid resin system was studied by Ozawa and Kissinger methods,respectively. TGA analysis showed that the incorporation of POSS improved the thermal properties of the E51/DDS system remarkably.

关 键 词：环氧树脂 笼型倍半硅氧烷 固化反应动力学 热性能 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]